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Fig. 1 | Fungal Biology and Biotechnology

Fig. 1

From: Mechanical, physical and thermal properties of composite materials produced with the basidiomycete Fomes fomentarius

Fig. 1

Compressive strength and thermal conductivity testing of fungal-based composite made of F. fomentarius and hemp shives. A Image of an exemplar specimen used for compressive and conductivity testing. B Stress–strain curves for all specimens with different height. C Compressive strength at 10% compression (δ10) as a function of the density of all specimens. D Thermal conductivity values determined for all specimens with different height

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Fungal Biology and Biotechnology

ISSN: 2054-3085

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